Wafer-Level Integrated Systems, Stuart K. Tewksbury
Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif Название: Wafer Level 3-D ICs Process Technology ISBN: 1441945628 ISBN-13(EAN): 9781441945624 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.
Автор: Reinhardt, Karen Название: Handbook of Silicon Wafer Cleaning Technology ISBN: 0323510841 ISBN-13(EAN): 9780323510844 Издательство: Elsevier Science Рейтинг: Цена: 39582.00 р. Наличие на складе: Поставка под заказ.
Описание:
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results.
The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.
The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.
Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits
Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries
Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Автор: Jeffrey Lang Название: Multi-Wafer Rotating MEMS Machines ISBN: 1461424593 ISBN-13(EAN): 9781461424598 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The collaboration and research that was developed to produce the MIT Gas Turbine Engine are described in this book. The book discusses the technical details that have gone into producing the engine and the overall systems-level tradeoffs, in particular its motor compressors and turbine generators, and the decisions that have been made.
Автор: Ewout S. J. Martens; Georges Gielen Название: High-Level Modeling and Synthesis of Analog Integrated Systems ISBN: 9048177316 ISBN-13(EAN): 9789048177318 Издательство: Springer Рейтинг: Цена: 19589.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Various approaches for finding optimal values for the parameters of analog cells have made their entrance in commercial applications. This book examines the opportunities, conditions, problems, solutions and systematic methodologies for this new generation of analog CAD tools.
Автор: Stuart K. Tewksbury Название: Wafer-Level Integrated Systems ISBN: 1461288983 ISBN-13(EAN): 9781461288985 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: From the perspective of complex systems, conventional Ie`s can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy.
Автор: Earl E. Swartzlander Jr. Название: Wafer Scale Integration ISBN: 1461288967 ISBN-13(EAN): 9781461288961 Издательство: Springer Рейтинг: Цена: 36197.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer.
Автор: Linda F. Atherton; Robert W. Atherton Название: Wafer Fabrication: Factory Performance and Analysis ISBN: 0792396197 ISBN-13(EAN): 9780792396192 Издательство: Springer Рейтинг: Цена: 32652.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Understanding the details of wafer fabrication processes and the related aspects of electronic devices can be an overwhelming task in the absence of a systematic, comprehensive view of the technology. This book presents a treatment of both the technology of wafer fabrication and the factories where it occurs.
Описание: Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data.
Автор: Shichun Qu; Yong Liu Название: Wafer-Level Chip-Scale Packaging ISBN: 149391555X ISBN-13(EAN): 9781493915552 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Автор: Marin Alexe; Ulrich G?sele Название: Wafer Bonding ISBN: 3642059155 ISBN-13(EAN): 9783642059155 Издательство: Springer Рейтинг: Цена: 32651.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.
Автор: Earl E. Swartzlander Jr. Название: Wafer Scale Integration ISBN: 0792390032 ISBN-13(EAN): 9780792390039 Издательство: Springer Рейтинг: Цена: 41787.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer.
ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru
