Описание: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Название: Nanoscale Silicon Devices ISBN: 113874932X ISBN-13(EAN): 9781138749320 Издательство: Taylor&Francis Рейтинг: Цена: 9645.00 р. Наличие на складе: Поставка под заказ.
Описание: Is Bigger Always Better? Explore the Behavior of Very Small Devices as Described by Quantum Mechanics Smaller is better when it comes to the semiconductor transistor. Nanoscale Silicon Devices examines the growth of semiconductor device miniaturization and related advances in material, device, circuit, and system design, and highlights the use of device scaling within the semiconductor industry. Device scaling, the practice of continuously scaling down the size of metal-oxide-semiconductor field-effect transistors (MOSFETs), has significantly improved the performance of small computers, mobile phones, and similar devices. The practice has resulted in smaller delay time and higher device density in a chip without an increase in power consumption. This book covers recent advancements and considers the future prospects of nanoscale silicon (Si) devices. It provides an introduction to new concepts (including variability in scaled MOSFETs, thermal effects, spintronics-based nonvolatile computing systems, spin-based qubits, magnetoelectric devices, NEMS devices, tunnel FETs, dopant engineering, and single-electron transfer), new materials (such as high-k dielectrics and germanium), and new device structures in three dimensions. It covers the fundamentals of such devices, describes the physics and modeling of these devices, and advocates further device scaling and minimization of energy consumption in future large-scale integrated circuits (VLSI). Additional coverage includes: Physics of nm scaled devices in terms of quantum mechanics Advanced 3D transistors: tri-gate structure and thermal effects Variability in scaled MOSFET Spintronics on Si platform NEMS devices for switching, memory, and sensor applications The concept of ballistic transport The present status of the transistor variability and more An indispensable resource, Nanoscale Silicon Devices serves device engineers and academic researchers (including graduate students) in the fields of electron devices, solid-state physics, and nanotechnology.
This book features the selected articles from the 25th annual symposiums Connecticut Microelectronics and Optoelectronics Consortium (CMOC), that focus on micro/nano-electronics and optoelectronics/Nano-photonics, to cover not only the technologies, but also the applications ranging from biosensors/nano-biosystems, to cyber security.
Enabling materials research involving growth and characterization of novel devices such as multi-bit nonvolatile random access memory with fast erase, high performance circuits, and their potential applications in developing new high-speed systems. Other articles focus on emerging nanoelectronic devices including topological insulators, spatial wavefunction switching (SWS) FETs as compact high-speed 2-bit SRAM circuits, quantum dot channel (QDC) FETs. Fundamental work on critical layer thickness in ZnSe/GaAs and other material systems impacts electronic and photonic devise integrating mismatched layers are also reported. While another article investigates linearly graded GaAsP-GaAs system with emphasis on strain relaxation.
Based on these technologies, area of analyzes multiple junction solar cells using semiconductors with different energy gaps, as a possible application were also featured; Pixel characterization of protein-based retinal implant, as well as a low-power and low-data-rate (100 kbps) fully integrated CMOS impulse radio ultra-wideband (IR-UWB) transmitter were investigated as a potential candidate for biomedical application. While other articles looked at carbon nanofibers/nanotubes for electrochemical sensing. In the area of cyber security, two articles present encrypted electron beam lithography fabricated nanostructures for authentication and nano-signatures for the identification of authentic electronic components.
In summary, papers presented in this volume involve various aspects of high performance materials and devices for implementing high-speed electronic systems.
Описание: This book covers the basic fundamentals of electronics and their applications in textiles and clothing product development. With increasing awareness about the e-textiles, researchers and scientists are finding ways to treat the textile materials integrating with electronics for communication/signal transferring applications. The book discusses
Автор: R.C. Alferness; Theodor Tamir; W.K. Burns; J.F. Do Название: Guided-Wave Optoelectronics ISBN: 3642970761 ISBN-13(EAN): 9783642970764 Издательство: Springer Рейтинг: Цена: 10448.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Specifically, the amalgamation of electronic and optics compo- nents into an integrated optoelectronics format is expected to provide a wide range of systems having miniaturized, high speed, broad band and reliable components for telecommunications, data processing, optical computing and other applications in the near and far future.
Описание: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Автор: Lall, Pradeep , Pecht, Michael G. , Hakim, Edwar Название: Influence of Temperature on Microelectronics and System Reliability ISBN: 0367400979 ISBN-13(EAN): 9780367400972 Издательство: Taylor&Francis Рейтинг: Цена: 9186.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures.
Автор: Yoshimura, Tetsuzo Название: Self-Organized 3D Integrated Optical Interconnects ISBN: 9814877042 ISBN-13(EAN): 9789814877046 Издательство: Taylor&Francis Рейтинг: Цена: 17762.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Currently, light waves are ready to come into boxes of computers in high-performance computing systems.
Описание: This book introduces a model-based quantitative performance indicator methodology which is applicable for performance, cost and reliability optimization of non-volatile memory. Covers reliability and cost optimization, performance parameters and more.
Автор: Alessandro Birolini Название: Quality and Reliability of Technical Systems ISBN: 3642979858 ISBN-13(EAN): 9783642979859 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: It is based on more than 20 years experience gained by the author in research and industry.The book covers theory, practice, and management aspects and addresses the needs of scientists, system-oriented engineers, engineers in development and production and project and quality assurance managers.
Автор: Andrew E. Perkins; Suresh K. Sitaraman Название: Solder Joint Reliability Prediction for Multiple Environments ISBN: 0387793933 ISBN-13(EAN): 9780387793931 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
Автор: Titu I. Bajenescu; Marius I. Bazu Название: Reliability of Electronic Components ISBN: 364263625X ISBN-13(EAN): 9783642636257 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
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