Автор: Andreas Hansson; Kees Goossens Название: On-Chip Interconnect with aelite ISBN: 1461427118 ISBN-13(EAN): 9781461427117 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a comprehensive description and implementation methodology for the Philips/NXP Aethereal/aelite Network-on-Chip. It uses real-world illustrations in the form of case studies and examples that communicate the power of the methods presented.
Описание: An understanding of high speed interconnect phenomena is necessary for modern designs such as routing and layout of computer motherboards. Computers have reached speeds where digital design must provide for these effects. The problem is that most engineers active today have not been trained in this subject.
Автор: Ian O`Connor; Gabriela Nicolescu Название: Integrated Optical Interconnect Architectures for Embedded Systems ISBN: 1489992049 ISBN-13(EAN): 9781489992048 Издательство: Springer Рейтинг: Цена: 16977.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book highlights current research in optical interconnect technologies and architectures. Particular emphasis is given to the ways photonic components are assembled into architectures to address the needs of data-intensive on-chip communication.
Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong Название: Fundamentals of Lead-Free Solder Interconnect Technology ISBN: 1461492653 ISBN-13(EAN): 9781461492658 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
Автор: Jari Nurmi; H. Tenhunen; J. Isoaho; Axel Jantsch Название: Interconnect-Centric Design for Advanced SOC and NOC ISBN: 1441954422 ISBN-13(EAN): 9781441954428 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design.
Описание: This book introduces the space community to the novel SpaceFibre protocol, developed under the guidance of the European Space Agency (ESA) as the forthcoming, high speed (Gbps) communication protocol for satellite on-board communication.
Автор: Sam Fuller Название: RapidIO: The Embedded System Interconnect ISBN: 0470092912 ISBN-13(EAN): 9780470092910 Издательство: Wiley Рейтинг: Цена: 18366.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Aims to bring together one useful volume on RapidIO interconnect technology, providing a reference work for the evaluation and understanding of RapidIO. Covering useful aspects of the specification, this title also answers most usage questions from both hardware and software engineers.
Автор: Sandeep Saini Название: Low Power Interconnect Design ISBN: 1461413222 ISBN-13(EAN): 9781461413226 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.
Автор: Pasricha, Sudeep Название: On-Chip Communication Architectures,- ISBN: 012373892X ISBN-13(EAN): 9780123738929 Издательство: Elsevier Science Рейтинг: Цена: 11283.00 р. Наличие на складе: Поставка под заказ.
Описание: System-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. This book deals with the concepts, research and trends in on-chip communication architecture design. It provides readers with a comprehensive survey of the standards for on-chip communication architectures.
Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer Название: Multi-Net Optimization of VLSI Interconnect ISBN: 149394262X ISBN-13(EAN): 9781493942626 Издательство: Springer Рейтинг: Цена: 13059.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.
Автор: Mustafa Celik; Larry Pileggi; Altan Odabasioglu Название: IC Interconnect Analysis ISBN: 1475776748 ISBN-13(EAN): 9781475776744 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
Автор: Coppola, Marcello Название: Design of Cost-Efficient Interconnect Processing Units ISBN: 1420044710 ISBN-13(EAN): 9781420044713 Издательство: Taylor&Francis Рейтинг: Цена: 18374.00 р. Наличие на складе: Поставка под заказ.
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