Автор: Horowitz Название: The Art of Electronics ISBN: 0521809266 ISBN-13(EAN): 9780521809269 Издательство: Cambridge Academ Рейтинг: Цена: 13622.00 р. Наличие на складе: Ожидается поступление.
Описание: At long last, here is the thoroughly revised and updated, and long-anticipated, third edition of the hugely successful The Art of Electronics. Widely accepted as the best single authoritative text on electronic circuit design, it will be an indispensable reference and the gold standard for anyone in the field.
Автор: Horowitz Paul Название: The art of electronics The x Chapters ISBN: 1108499945 ISBN-13(EAN): 9781108499941 Издательство: Cambridge Academ Рейтинг: Цена: 8870.00 р. Наличие на складе: Заказано в издательстве.
Описание: The x-Chapters is the missing pieces of The Art of Electronics, to be used either as its complement, or as a direct route to exploring some of the most exciting and oft-overlooked topics in advanced electronic engineering. Students, researchers and practitioners will find here techniques and circuits that are unavailable elsewhere.
Автор: Hayes Название: Learning the Art of Electronics ISBN: 0521177235 ISBN-13(EAN): 9780521177238 Издательство: Cambridge Academ Рейтинг: Цена: 17195.00 р. Наличие на складе: Нет в наличии.
Описание: Turn to this book if you want to learn about different types of circuits and their behavior. You will gain a deep and intuitive understanding of circuit operation, be exposed to advanced circuit designs, and learn to build analog and digital devices from first principles using basic components.
Автор: Lau John H., Lee Ning-Cheng Название: Assembly and Reliability of Lead-Free Solder Joints ISBN: 9811539197 ISBN-13(EAN): 9789811539190 Издательство: Springer Цена: 16070.00 р. Наличие на складе: Поставка под заказ.
Описание: This book is intended for periodontal residents and practicing periodontists who wish to incorporate the principles of moderate sedation into daily practice. Comprehensive airway management and rescue skills are then documented in detail so that the patient may be properly managed in the event that the sedation progresses beyond the intended level.
Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.
Автор: A.C. Tan Название: Tin and Solder Plating in the Semiconductor Industry ISBN: 0412482401 ISBN-13(EAN): 9780412482403 Издательство: Springer Рейтинг: Цена: 28734.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Provides coverage of the theory and practice of plating semiconductor devices. This book introduces the principal concepts of plating and discusses its practice. It is designed to help electroplaters achieve `zero-defect` plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Автор: Andrew E. Perkins; Suresh K. Sitaraman Название: Solder Joint Reliability Prediction for Multiple Environments ISBN: 1441946349 ISBN-13(EAN): 9781441946348 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
Автор: John Hock Lye Pang Название: Lead Free Solder ISBN: 1489991166 ISBN-13(EAN): 9781489991164 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Lead-free solders play a crucial role in the electronics industry. Featuring in-depth design and reliability information on lead-free deformation and failure analysis, this book covers a wide range of topics including advanced material mechanics theory.
Автор: Suhir, Ephraim (portland State University, Portland, Usa) Название: Avoiding inelastic strains in solder joint interconnections of ic devices ISBN: 113862473X ISBN-13(EAN): 9781138624733 Издательство: Taylor&Francis Рейтинг: Цена: 23734.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
Автор: Mohd N. Tamin; Norhashimah M. Shaffiar Название: Solder Joint Reliability Assessment ISBN: 3319000918 ISBN-13(EAN): 9783319000916 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
Автор: King-Ning Tu Название: Solder Joint Technology ISBN: 1441922849 ISBN-13(EAN): 9781441922847 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The European Union`s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.
Автор: Evans John W., Kwon Dong-il, Engelmaier Werner Название: A Guide to Lead-free Solders / Physical Metallurgy and Reliability ISBN: 1846283094 ISBN-13(EAN): 9781846283093 Издательство: Springer Рейтинг: Цена: 17462.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.
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