Описание: This book discusses some research results for CMOS-compatible silicon-based optical devices and interconnections. With accurate simulation and experimental demonstration, it provides insights on silicon-based modulation, advanced multiplexing, polarization and efficient coupling controlling technologies, which are widely used in silicon photonics. Researchers, scientists, engineers and especially students in the field of silicon photonics can benefit from the book. This book provides valuable knowledge, useful methods and practical design that can be considered in emerging silicon-based optical interconnections and communications. And it also give some guidance to student how to organize and complete an good dissertation.
Описание: This book offers a thorough understanding of the applications of finite element method (FEM) to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.
Автор: Tan Cher Ming Название: Electromigration In Ulsi Interconnections ISBN: 9814273325 ISBN-13(EAN): 9789814273329 Издательство: World Scientific Publishing Рейтинг: Цена: 15840.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.
Автор: Giorgio Valmorbida; Alexandre Seuret; Islam Boussa Название: Delays and Interconnections: Methodology, Algorithms and Applications ISBN: 3030115534 ISBN-13(EAN): 9783030115531 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book contains advances on the theory and applications of time-delay systems with particular focus on interconnected systems. The methods for stability analysis and control design are based on time-domain and frequency-domain approaches, for continuous-time and sampled-data systems, linear and nonlinear systems. This volume is a valuable source of reference for control practitioners, graduate students, and scientists researching practical as well as theoretical solutions to a variety of control problems inevitably influenced by the presence of time delays. The contents are organized in three parts: Interconnected Systems analysis, Modeling and and Analysis for Delay systems, and Stabilization and Control Strategies for Delay Systems. This volume presents a selection of 19 contributions presented in the 4th DelSys Workshop which took place in Gif-sur-Yvette, France November 25-27, 2015.
Автор: G.G. Harman; Pavel Mach Название: Microelectronic Interconnections and Assembly ISBN: 9401061599 ISBN-13(EAN): 9789401061599 Издательство: Springer Рейтинг: Цена: 12157.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996
Автор: Andrew B. Kahng; Gabriel Robins Название: On Optimal Interconnections for VLSI ISBN: 0792394836 ISBN-13(EAN): 9780792394839 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Describes, from a geometric perspective, algorithms for high-performance, high-density interconnections during the global and detailed routing phases of circuit layout. This book addresses area minimization, with a focus on near-optimal approximation algorithms for minimum-cost Steiner routing.
Автор: William Greig Название: Integrated Circuit Packaging, Assembly and Interconnections ISBN: 1441939237 ISBN-13(EAN): 9781441939234 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.
Автор: Andrew B. Kahng; Gabriel Robins Название: On Optimal Interconnections for VLSI ISBN: 1441951458 ISBN-13(EAN): 9781441951458 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Recent minimum-delay constructions are highlighted, including provably good cost-radius tradeoffs, critical-sink routing algorithms, Elmore delay-optimal routing, graph Steiner arborescences, non-tree routing, and wiresizing.
Автор: M. Kojic; Klaus-Jurgen Bathe Название: Inelastic Analysis of Solids and Structures ISBN: 3642061575 ISBN-13(EAN): 9783642061578 Издательство: Springer Рейтинг: Цена: 23508.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Inelastic Analysis of Solids and Structures presents in a unified manner the physical and theoretical background of inelastic material models and computational methods, and illustrates the behavior of the models in typical engineering conditions.
Автор: Zenon Mr?z; Dieter Weichert; Stanislaw Dorosz Название: Inelastic Behaviour of Structures under Variable Loads ISBN: 0792333977 ISBN-13(EAN): 9780792333975 Издательство: Springer Рейтинг: Цена: 41787.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This collection of papers is a state of the art presentation of theories and methods related to the problem of the behaviour of mechanical structures under variable loads beyond their elastic limit In particular, the problems of shakedown, ratchetting, transient and asymptotic cyclic states are addressed.
Описание: This book exposes a number of mathematical models for fracture of growing difficulty.
Автор: Christian Sch?ller Название: Inelastic Light Scattering of Semiconductor Nanostructures ISBN: 3642436757 ISBN-13(EAN): 9783642436758 Издательство: Springer Рейтинг: Цена: 26552.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The field of semiconductor nanostructures is of enormous and still-growing research interest. On the other hand, they allow, in specially tailored systems, the investigation of fundamental properties such as many-particle interactions of electrons in reduced dimensions.
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