Electromigration Modeling at Circuit Layout Level, Cher Ming Tan; Feifei He
Автор: Posser Название: Electromigration Inside Logic Cells ISBN: 3319488988 ISBN-13(EAN): 9783319488981 Издательство: Springer Рейтинг: Цена: 12157.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.
Автор: Tan Cher Ming Название: Electromigration In Ulsi Interconnections ISBN: 9814273325 ISBN-13(EAN): 9789814273329 Издательство: World Scientific Publishing Рейтинг: Цена: 15840.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.
Описание: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field.
Описание: Praise for CMOS: Circuit Design, Layout, and Simulation, Second Edition from the Technical Reviewers "A refreshing industrial flavor. Design concepts are presented as they are needed for 'just-in-time' learning. Simulating and designing circuits using SPICE is emphasized with literally hundreds of examples. Very few textbooks contain as much detail as this one. Highly recommended!" -Paul M. Furth, New Mexico State University "This book builds a solid knowledge of CMOS circuit design from the ground up. With coverage of process integration, layout, analog and digital models, noise mechanisms, memory circuits, references, amplifiers, PLLs/DLLs, dynamic circuits, and data converters, the text is an eellent reference for both experienced and novice designers alike." -Tyler J. Gomm, Design Engineer, Micron Technology, Inc. "The second edition builds upon the success of the first with new chapters that cover additional material such as oversampled converters and non-volatile memories. This is becoming the de facto standard textbook to have on every analog and mixed-signal designer's bookshelf." -Joe Walsh, Design Engineer, AMI Semiconductor CMOS circuits from design to implementation CMOS: Circuit Design, Layout, and Simulation, Second Edition covers the practical design of both analog and digital integrated circuits, offering a vital contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and much more. This edition takes a two-path approach to the topics; design techniques are developed for both long- and short-channel CMOS technologies and then compared. The results are multidimensional explanations that allow readers deep insight into the design process. Features include: * Integrated-circuit layout software for Windows designed by David Boyce * Updated materials to reflect CMOS technology's movement into nanometer sizes * Discussions on phase- and delay-locked loops, mixed-signal circuits, data converters, and circuit noise * More than 1,000 figures, 200 examples, and over 500 end-of-chapter problems * In-depth coverage of both analog and digital circuit-level design techniques * Real-world process parameters and design rules * Associated Web site (cmosedu.com) provides examples, solutions, and SPICE simulation netlists
Описание: This book introduces readers to a variety of tools for automatic analog integrated circuit (IC) sizing and optimization. The authors provide a historical perspective on the early methods proposed to tackle automatic analog circuit sizing, with emphasis on the methodologies to size and optimize the circuit, and on the methodologies to estimate the circuit’s performance. The discussion also includes robust circuit design and optimization and the most recent advances in layout-aware analog sizing approaches. The authors describe a methodology for an automatic flow for analog IC design, including details of the inputs and interfaces, multi-objective optimization techniques, and the enhancements made in the base implementation by using machine leaning techniques. The Gradient model is discussed in detail, along with the methods to include layout effects in the circuit sizing. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the quality of their designs, or use them as starting point for a new tool. An extensive set of application examples is included to demonstrate the capabilities and features of the methodologies described.
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