Power Electronic Packaging, Yong Liu

Автор: Ferreira, J.A.
Название: Electromagnetic Modelling of Power Electronic Converters
ISBN: 0792390342 ISBN-13(EAN): 9780792390343
Издательство: Springer
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Цена: 20896.00 р.
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Описание: The era of the personal computer has, without doubt, permanently altered our life style in a myriad of ways. The "brain" of the personal computer is the microprocessor (together with RAM and ROM) which makes the decisions needed for the computer to perform in the desired manner. The microprocessor continues to evolve as increasingly complex tasks are required.

While not sharing the limelight of the microprocessor, the "heart" of the personal computer, namely the power supply, is equally important since without the necessary source of power the microprocessor would be a useless piece of silicon. The power supply of twenty years ago was much different than its modem day equivalent. At the dawn of the personal computer era in the late 1970s, de power was obtained from a simple diode bridge.

However, the need for smooth, regulated DC at low voltage required at the same time both a bulky input transformer and a large dc side ftlter. Those computer fans present at the birth of this industry can remember the large boxes housing our Altair, Cromemco and Northstar computers which was made necessary largely because of the huge power supply. It is not well appreciated but certainly true that the huge sucess of the Apple II computer in those days was due, at least in part, to the relatively slim proftle of the machine.

This sleek appearance was largely due to the adoption of the then new and unproven switched mode power supply.

Автор: Frank Riley; Electronic Packaging and Production
Название: The Electronics Assembly Handbook
ISBN: 3662131633 ISBN-13(EAN): 9783662131633
Издательство: Springer
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Цена: 16979.00 р.
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Описание: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly.

Автор: Y.C. Lee; W.T. Chen
Название: Manufacturing Challenges in Electronic Packaging
ISBN: 0412620308 ISBN-13(EAN): 9780412620300
Издательство: Springer
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Цена: 19591.00 р.
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Описание: Addresses both advanced packaging and manufacturing activities, enhanced by reviews and analysis. This book is useful as a reference for professionals who need to meet the goal of manufacturing with only one defective package in a million escaping undetected.

Автор: R.R. Tummala; Marija Kosec; W.K. Jones; Darko Bela
Название: Electronic Packaging for High Reliability, Low Cost Electronics
ISBN: 0792352181 ISBN-13(EAN): 9780792352181
Издательство: Springer
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Цена: 30606.00 р.
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Описание: Integrated circuits require fresh packaging techniques if the devices are to remain within cost and size constraints. This volume addresses new hermetic packaging, materials for thermal management and assembly, and components that integrate multiple functions while retaining previous high levels of reliability.

Автор: Lawrence L. Rosine
Название: Advances in Electronic Circuit Packaging
ISBN: 1489972951 ISBN-13(EAN): 9781489972958
Издательство: Springer
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Цена: 12157.00 р.
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Автор: Lawrence L. Rosine
Название: Advances in Electronic Circuit Packaging
ISBN: 148997296X ISBN-13(EAN): 9781489972965
Издательство: Springer
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Цена: 12157.00 р.
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Автор: Gerald A. Walker
Название: Advances in Electronic Circuit Packaging
ISBN: 1489972978 ISBN-13(EAN): 9781489972972
Издательство: Springer
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Цена: 12157.00 р.
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Автор: Xingcun Colin Tong Ph.D
Название: Advanced Materials for Thermal Management of Electronic Packaging
ISBN: 1461427924 ISBN-13(EAN): 9781461427926
Издательство: Springer
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Цена: 23508.00 р.
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Описание: This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.

Автор: Y.C. Lee; W.T. Chen
Название: Manufacturing Challenges in Electronic Packaging
ISBN: 1461376599 ISBN-13(EAN): 9781461376590
Издательство: Springer
Рейтинг:
Цена: 19591.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: About five to six years ago, the words `packaging and manufacturing` started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.

Автор: Luc Martens
Название: High-Frequency Characterization of Electronic Packaging
ISBN: 0792383079 ISBN-13(EAN): 9780792383079
Издательство: Springer
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Цена: 19591.00 р.
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Описание: Offers an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.