RF and Microwave Microelectronics Packaging, Ken Kuang; Franklin Kim; Sean S. Cahill
Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf Название: Microelectronics Packaging Handbook ISBN: 0412084511 ISBN-13(EAN): 9780412084515 Издательство: Springer Рейтинг: Цена: 27251.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf Название: Microelectronics Packaging Handbook ISBN: 0412084414 ISBN-13(EAN): 9780412084416 Издательство: Springer Рейтинг: Цена: 41925.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies.
Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf Название: Microelectronics Packaging Handbook ISBN: 1461368294 ISBN-13(EAN): 9781461368298 Издательство: Springer Рейтинг: Цена: 36570.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Electronics has become the largest industry, surpassing agriCUlture, auto. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Автор: Luigi Fortuna; Giuseppe Ferla; Antonio Imbruglia Название: Microelectronics and Microsystems ISBN: 1447111745 ISBN-13(EAN): 9781447111740 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book presents the best contributions, extracted from the theses written by the students who have attended the second edition of the Master in Microelectronics and Systems that has been organized by the Universita degli Studi di Catania and that has been held at the STMicroelectronics Company (Catania Site) from May 2000 to January 2001.
Автор: Maurizio Di Paolo Emilio Название: Microelectronics ISBN: 3319364235 ISBN-13(EAN): 9783319364230 Издательство: Springer Рейтинг: Цена: 11753.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Introduction.- P-spice simulation.- Solid state Physics.- Diode and circuits.- Bipolar transistor.- MOS transistor.- Operational amplifier.- Amplifiers.- Frequency response.- High frequency circuits.- Digital circuits: logic gates.- Combinatorial circuits.- Sequential circuits.- Logic families.- Memories and applications.- PCB design.- Routing PCB.- Design flow of PCB.- Conclusion.
Автор: J. Greer Название: Nano and Giga Challenges in Microelectronics, ISBN: 0444514945 ISBN-13(EAN): 9780444514943 Издательство: Elsevier Science Рейтинг: Цена: 16843.00 р. Наличие на складе: Поставка под заказ.
Описание: Gives an introduction for engineers and researchers wishing to obtain a fundamental knowledge of the edge in technology research. This book also acts as an essential reference for the "gurus" wishing to keep abreast of the directions and challenges in microelectronic technology development and future trends.
Автор: Ken Kuang; Rick Sturdivant Название: RF and Microwave Microelectronics Packaging II ISBN: 3319516965 ISBN-13(EAN): 9783319516967 Издательство: Springer Рейтинг: Цена: 16769.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
Автор: John Lau Название: Thermal Stress and Strain in Microelectronics Packaging ISBN: 1468477692 ISBN-13(EAN): 9781468477696 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.
Автор: Alexander A. Ignatiev; Alexander V. Lyashenko Название: Heteromagnetic Microelectronics ISBN: 1489989722 ISBN-13(EAN): 9781489989727 Издательство: Springer Рейтинг: Цена: 23508.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Devoted to heteromagnetic microelectronics, this book is based on original material from the author`s programs of designing heteromagnetic microsystems of various types. It includes pioneering results of research on magnetoelectronics of millimetric waves.
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