Electromigration Inside Logic Cells: Modeling, Analyzing and Mitigating Signal Electromigration in Nanocmos, Posser Gracieli, Sapatnekar Sachin S., Reis Ricardo

Автор: Posser
Название: Electromigration Inside Logic Cells
ISBN: 3319488988 ISBN-13(EAN): 9783319488981
Издательство: Springer
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Цена: 12157.00 р.
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Описание: This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.

Автор: Tan Cher Ming
Название: Electromigration In Ulsi Interconnections
ISBN: 9814273325 ISBN-13(EAN): 9789814273329
Издательство: World Scientific Publishing
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Цена: 15840.00 р.
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Описание: Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.

Автор: Cher Ming Tan; Feifei He
Название: Electromigration Modeling at Circuit Layout Level
ISBN: 9814451207 ISBN-13(EAN): 9789814451208
Издательство: Springer
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Цена: 9141.00 р.
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Описание: Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.

Автор: Jens Lienig; Matthias Thiele
Название: Fundamentals of Electromigration-Aware Integrated Circuit Design
ISBN: 3030088111 ISBN-13(EAN): 9783030088118
Издательство: Springer
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Цена: 11179.00 р.
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Описание: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.