Design and Crosstalk Analysis in Carbon Nanotube Interconnects, Sathyakam P. Uma, Mallick Partha Sharathi
Автор: Sathyakam P. Uma, Mallick Partha Sharathi Название: Design and CrossTalk Analysis in Carbon Nanotube Interconnects ISBN: 9811588872 ISBN-13(EAN): 9789811588877 Издательство: Springer Цена: 16769.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik Название: Crosstalk in Modern On-Chip Interconnects ISBN: 9811007993 ISBN-13(EAN): 9789811007996 Издательство: Springer Рейтинг: Цена: 9141.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.
Автор: Brajesh Kumar Kaushik; Manoj Kumar Majumder Название: Carbon Nanotube Based VLSI Interconnects ISBN: 8132220463 ISBN-13(EAN): 9788132220466 Издательство: Springer Рейтинг: Цена: 8489.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects.
Автор: Todri-Sanial Aida, Dijon Jean, Maffucci Antonio Название: Carbon Nanotubes for Interconnects: Process, Design and Applications ISBN: 3319806424 ISBN-13(EAN): 9783319806426 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects.
Автор: Todri-Sanial Название: Carbon Nanotubes for Interconnects ISBN: 3319297449 ISBN-13(EAN): 9783319297446 Издательство: Springer Рейтинг: Цена: 16070.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Автор: Pinhong Chen; Desmond A. Kirkpatrick; Kurt Keutzer Название: Static Crosstalk-Noise Analysis ISBN: 1475779496 ISBN-13(EAN): 9781475779493 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Hartmut Grabinski Название: Interconnects in VLSI Design ISBN: 1461369541 ISBN-13(EAN): 9781461369547 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999.
Автор: S. Jayanthy; M.C. Bhuvaneswari Название: Test Generation of Crosstalk Delay Faults in VLSI Circuits ISBN: 9811347840 ISBN-13(EAN): 9789811347849 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
This book describes a variety of test generation algorithms for testing crosstalk delay faults in VLSI circuits. It introduces readers to the various crosstalk effects and describes both deterministic and simulation-based methods for testing crosstalk delay faults. The book begins with a focus on currently available crosstalk delay models, test generation algorithms for delay faults and crosstalk delay faults, before moving on to deterministic algorithms and simulation-based algorithms used to test crosstalk delay faults. Given its depth of coverage, the book will be of interest to design engineers and researchers in the field of VLSI Testing.
Автор: S. Jayanthy; M.C. Bhuvaneswari Название: Test Generation of Crosstalk Delay Faults in VLSI Circuits ISBN: 9811324921 ISBN-13(EAN): 9789811324925 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
This book describes a variety of test generation algorithms for testing crosstalk delay faults in VLSI circuits. It introduces readers to the various crosstalk effects and describes both deterministic and simulation-based methods for testing crosstalk delay faults. The book begins with a focus on currently available crosstalk delay models, test generation algorithms for delay faults and crosstalk delay faults, before moving on to deterministic algorithms and simulation-based algorithms used to test crosstalk delay faults. Given its depth of coverage, the book will be of interest to design engineers and researchers in the field of VLSI Testing.
Описание: This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
Автор: Dhiman Rohit, Chandel Rajeevan Название: VLSI and Post-CMOS Electronics: Devices, Circuits and Interconnects ISBN: 1839530537 ISBN-13(EAN): 9781839530531 Издательство: Неизвестно Рейтинг: Цена: 25749.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
VLSI, or Very-Large-Scale-Integration, is the practice of combining billions of transistors to create an integrated circuit. At present, VLSI circuits are realised using CMOS technology. However, the demand for ever smaller, more efficient circuits is now pushing the limits of CMOS. Post-CMOS refers to the possible future digital logic technologies beyond the CMOS scaling limits. This 2-volume set addresses the current state of the art in VLSI technologies and presents potential options for post-CMOS processes.
VLSI and Post-CMOS Electronics is a useful reference guide for researchers, engineers and advanced students working in the area of design and modelling of VLSI and post-CMOS devices and their circuits. Volume 1 focuses on design, modelling and simulation, including applications in low voltage and low power VLSI, and post-CMOS devices and circuits. Volume 2 addresses a wide range of devices, circuits and interconnects.
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