Graphene and vlsi interconnects, Tan, Cher Ming Narula, Udit Sangwan, Vivek

Автор: Yoshimura, Tetsuzo
Название: Self-Organized 3D Integrated Optical Interconnects
ISBN: 9814877042 ISBN-13(EAN): 9789814877046
Издательство: Taylor&Francis
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Цена: 17762.00 р.
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Описание: This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Currently, light waves are ready to come into boxes of computers in high-performance computing systems.

Автор: Gall
Название: Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009
ISBN: 1605111295 ISBN-13(EAN): 9781605111292
Издательство: Cambridge Academ
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Цена: 15523.00 р.
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Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Sathyakam P. Uma, Mallick Partha Sharathi
Название: Design and Crosstalk Analysis in Carbon Nanotube Interconnects
ISBN: 9811588902 ISBN-13(EAN): 9789811588907
Издательство: Springer
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Цена: 16769.00 р.
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Описание: Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries.

Автор: Yosi Shacham-Diamand; Tetsuya Osaka; Madhav Datta;
Название: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
ISBN: 1461497442 ISBN-13(EAN): 9781461497448
Издательство: Springer
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Цена: 32004.00 р.
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Описание: Electromechanical processes for Ultra-large-Scale Integration technology for Integrated Circuits applications is a new frontier in electrochemistry and science. This book details copper based interconnect technology for ULSI technology to ICs application.

Автор: Carter
Название: Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics — 2004
ISBN: 1107409225 ISBN-13(EAN): 9781107409224
Издательство: Cambridge Academ
Цена: 4277.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Oehrlein
Название: Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
ISBN: 110741315X ISBN-13(EAN): 9781107413153
Издательство: Cambridge Academ
Цена: 4277.00 р.
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Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Gall
Название: Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009
ISBN: 1107408318 ISBN-13(EAN): 9781107408319
Издательство: Cambridge Academ
Цена: 4277.00 р.
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Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Moser Philip
Название: Energy-Efficient Vcsels for Optical Interconnects
ISBN: 3319370898 ISBN-13(EAN): 9783319370897
Издательство: Springer
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Цена: 13974.00 р.
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Описание: This dissertation provides the first systematic analysis of the dynamic energy efficiency of vertical-cavity surface-emitting lasers (VCSELs) for optical interconnects, a key technology to address the pressing ecological and economic issues of the exponentially growing energy consumption in data centers.

Автор: Alex Mutig
Название: High Speed VCSELs for Optical Interconnects
ISBN: 3642266797 ISBN-13(EAN): 9783642266799
Издательство: Springer
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Цена: 13974.00 р.
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Описание: Systematically surveying the state of the art in vertical cavity surface emitting lasers, this thesis examines their present limitations as well as offering a catalogue of solutions through modeling, fabricating and testing at commercially crucial wavelengths.

Автор: G?nter Grossmann; Christian Zardini
Название: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ISBN: 1447158407 ISBN-13(EAN): 9781447158400
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.

Автор: Lin
Название: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
ISBN: 1107408717 ISBN-13(EAN): 9781107408715
Издательство: Cambridge Academ
Цена: 4277.00 р.
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Описание: This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

Автор: Sathyakam P. Uma, Mallick Partha Sharathi
Название: Design and CrossTalk Analysis in Carbon Nanotube Interconnects
ISBN: 9811588872 ISBN-13(EAN): 9789811588877
Издательство: Springer
Цена: 16769.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries.