Контакты/Проезд  Доставка и Оплата Помощь/Возврат
История
  +7(495) 980-12-10
  пн-пт: 10-18 сб,вс: 11-18
  shop@logobook.ru
   
    Поиск книг                    Поиск по списку ISBN Расширенный поиск    
Найти
  Зарубежные издательства Российские издательства  
Авторы | Каталог книг | Издательства | Новинки | Учебная литература | Акции | Хиты | |
 

3D Microelectronic Packaging: From Architectures to Applications, Li Yan, Goyal Deepak


Варианты приобретения
Цена: 23757.00р.
Кол-во:
 о цене
Наличие: Отсутствует. Возможна поставка под заказ.

При оформлении заказа до: 2025-07-28
Ориентировочная дата поставки: Август-начало Сентября
При условии наличия книги у поставщика.

Добавить в корзину
в Мои желания

Автор: Li Yan, Goyal Deepak
Название:  3D Microelectronic Packaging: From Architectures to Applications
ISBN: 9789811570926
Издательство: Springer
Классификация:



ISBN-10: 9811570922
Обложка/Формат: Paperback
Страницы: 642
Вес: 0.88 кг.
Дата издания: 08.12.2021
Серия: Springer series in advanced microelectronics
Язык: English
Издание: 2nd ed. 2021
Иллюстрации: 100 tables, color; 205 illustrations, color; 94 illustrations, black and white; xvii, 622 p. 299 illus., 205 illus. in color.
Размер: 23.39 x 15.60 x 3.28 cm
Читательская аудитория: Professional & vocational
Подзаголовок: From architectures to applications
Ссылка на Издательство: Link
Рейтинг:
Поставляется из: Германии
Описание: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.


3D Microelectronic Packaging: From Architectures to Applications

Автор: Li Yan, Goyal Deepak
Название: 3D Microelectronic Packaging: From Architectures to Applications
ISBN: 9811570892 ISBN-13(EAN): 9789811570896
Издательство: Springer
Цена: 23757.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

3D Microelectronic Packaging: From Fundamentals to Applications

Автор: Li Yan, Goyal Deepak
Название: 3D Microelectronic Packaging: From Fundamentals to Applications
ISBN: 3319830864 ISBN-13(EAN): 9783319830865
Издательство: Springer
Рейтинг:
Цена: 25155.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

Thermal Design of Liquid Cooled Microelectronic Equipment

Автор: Yeh Lian-Tuu
Название: Thermal Design of Liquid Cooled Microelectronic Equipment
ISBN: 0791861937 ISBN-13(EAN): 9780791861936
Издательство: Mare Nostrum (Eurospan)
Рейтинг:
Цена: 20097.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.

Silicon Nitride for Microelectronic Applications

Автор: J. T. Milek
Название: Silicon Nitride for Microelectronic Applications
ISBN: 1461596114 ISBN-13(EAN): 9781461596110
Издательство: Springer
Рейтинг:
Цена: 6986.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Diffusion Mask Applications . . . . . . . . . . . . `" 11 Glass-to-Metal Seals . 23 Passivation Applications . 24 Isolation . 76 Radiation Hardening Applications .

Radio-Frequency Microelectronic Circuits for Telecommunication Applications

Автор: Yannis E. Papananos
Название: Radio-Frequency Microelectronic Circuits for Telecommunication Applications
ISBN: 1441951040 ISBN-13(EAN): 9781441951045
Издательство: Springer
Рейтинг:
Цена: 16977.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.

Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing

Автор: Liu
Название: Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing
ISBN: 0470827807 ISBN-13(EAN): 9780470827802
Издательство: Wiley
Рейтинг:
Цена: 17416.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Microelectronic circuits

Автор: Sedra, Adel S. (distinguished Professor Emeritus Of Electrical And Computer Engineering, Distinguished Professor Emeritus Of Electrical And Computer E
Название: Microelectronic circuits
ISBN: 0190853506 ISBN-13(EAN): 9780190853501
Издательство: Oxford Academ
Рейтинг:
Цена: 20907.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This Courseware package consist out of two publications, Agile Foundation Courseware - English and you are adviced to obtain the publication Agile for responsive organizations - A Pocket Guide. This courseware is for the Agile Foundation certification by the Agile Consortium, and follows the Certify to Inspire philosophy, enabling continuous learning and an adaptive mindset in an Agile world and corporate environment. This courseware has been reviewed by Agile Consortium board members and been accredited by Van Haren Learning Solutions.This Courseware provides a didactic journey in Agile, including teasers, energizers and many little assignments. There is also a reference to free online Agile literature and to the online Agile Foundation demo exam. The main modules of this exam are: o What is Agileo Agile Culture and Leadershipo Scrumo Methods and frameworkso Agile way of workingo Value and Continuous deliveryo Empiricism and improvementModules of this course ware:o What is Agileo Fundamental systems to Agile¢ XP¢ Crystal¢ Scrum¢ DSDMo Philosophizingo Scalingo Kanbano Lean StartupAbout the Agile Foundation CertificationThe Agile Foundation certificate is intended for those who are relatively new to the concept of "Agile" and would like to discover what it exactly entails.The idea behind this exam is that you are serious about delving into the Agility concept and related practices. How you decide to do that will be up to you. You can read books, articles, or blogs. You can also watch videos, listen to podcasts, attend events, or observe others who are working with Agile in practice. Or another possibility is to follow a course in Agile.The Agile Foundation Exam is an independent exam meaning it is not tied to a specific method. If you have the Agile Foundation certificate, you will have demonstrated you understand what Agile means and that you can identify the methods and concepts most commonly used in Agile organizations.

Force Sensors for Microelectronic Packaging Applications

Автор: J?rg Schwizer; Michael Mayer; Oliver Brand
Название: Force Sensors for Microelectronic Packaging Applications
ISBN: 3642060633 ISBN-13(EAN): 9783642060632
Издательство: Springer
Рейтинг:
Цена: 20962.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.

Radio-Frequency Microelectronic Circuits for Telecommunication Applications

Автор: Yannis E. Papananos
Название: Radio-Frequency Microelectronic Circuits for Telecommunication Applications
ISBN: 0792386418 ISBN-13(EAN): 9780792386414
Издательство: Springer
Рейтинг:
Цена: 20896.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.

MEMS Silicon Oscillating Accelerometers and Readout Circuits

Автор: Yong Ping Xu
Название: MEMS Silicon Oscillating Accelerometers and Readout Circuits
ISBN: 877022045X ISBN-13(EAN): 9788770220453
Издательство: Taylor&Francis
Рейтинг:
Цена: 14086.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.

Microelectronic Materials and Processes

Автор: R.A. Levy
Название: Microelectronic Materials and Processes
ISBN: 0792301544 ISBN-13(EAN): 9780792301547
Издательство: Springer
Рейтинг:
Цена: 48774.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986

Chemical Perspectives of Microelectronic Materials

Автор: Gross
Название: Chemical Perspectives of Microelectronic Materials
ISBN: 1107410843 ISBN-13(EAN): 9781107410848
Издательство: Cambridge Academ
Цена: 4277.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru
   В Контакте     В Контакте Мед  Мобильная версия