3D Interconnect Architectures for Heterogeneous Technologies, Bamberg
Автор: Chong Leong, Gan, Chen-Yu, Huang Название: Interconnect Reliability in Advanced Memory Device Packaging ISBN: 3031267079 ISBN-13(EAN): 9783031267079 Издательство: Springer Рейтинг: Цена: 27950.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Описание: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
Автор: Ian O`Connor; Gabriela Nicolescu Название: Integrated Optical Interconnect Architectures for Embedded Systems ISBN: 1489992049 ISBN-13(EAN): 9781489992048 Издательство: Springer Рейтинг: Цена: 16977.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book highlights current research in optical interconnect technologies and architectures. Particular emphasis is given to the ways photonic components are assembled into architectures to address the needs of data-intensive on-chip communication.
Автор: Michel Dubois; Shreekant S. Thakkar Название: Cache and Interconnect Architectures in Multiprocessors ISBN: 0792390741 ISBN-13(EAN): 9780792390749 Издательство: Springer Рейтинг: Цена: 20956.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Cache And Interconnect Architectures In Multiprocessors Eilat, Israel May 25-261989 Michel Dubois UniversityofSouthernCalifornia Shreekant S. Thakkar SequentComputerSystems The aim of the workshop was to bring together researchers working on cache coherence protocols for shared-memory multiprocessors with various interconnect architectures. Shared-memory multiprocessors have become viable systems for many applications. Bus- based shared-memory systems (Eg. Sequent's Symmetry, Encore's Multimax) are currently limited to 32 processors. The fIrst goal of the workshop was to learn about the performance ofapplications on current cache-based systems. The second goal was to learn about new network architectures and protocols for future scalable systems. These protocols and interconnects would allow shared-memory architectures to scale beyond current imitations. The workshop had 20 speakers who talked about their current research. The discussions were lively and cordial enough to keep the participants away from the wonderful sand and sun for two days. The participants got to know each other well and were able to share their thoughts in an informal manner. The workshop was organized into several sessions. The summary of each session is described below. This book presents revisions of some of the papers presented at the workshop.
Автор: Pasricha, Sudeep Название: On-Chip Communication Architectures,- ISBN: 012373892X ISBN-13(EAN): 9780123738929 Издательство: Elsevier Science Рейтинг: Цена: 11283.00 р. Наличие на складе: Нет в наличии.
Описание: System-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. This book deals with the concepts, research and trends in on-chip communication architecture design. It provides readers with a comprehensive survey of the standards for on-chip communication architectures.
Автор: Coppola, Marcello Название: Design of Cost-Efficient Interconnect Processing Units ISBN: 1420044710 ISBN-13(EAN): 9781420044713 Издательство: Taylor&Francis Рейтинг: Цена: 18374.00 р. Наличие на складе: Нет в наличии.
Автор: Ayan Mandal; Sunil P. Khatri; Rabi Mahapatra Название: Source-Synchronous Networks-On-Chip ISBN: 1493948172 ISBN-13(EAN): 9781493948178 Издательство: Springer Рейтинг: Цена: 14365.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. It provides circuit-level details of the NoC and includes architectural simulations of the NoC.
Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer Название: Multi-Net Optimization of VLSI Interconnect ISBN: 149394262X ISBN-13(EAN): 9781493942626 Издательство: Springer Рейтинг: Цена: 13059.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.
Автор: Sandeep Saini Название: Low Power Interconnect Design ISBN: 1461413222 ISBN-13(EAN): 9781461413226 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.
Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong Название: Fundamentals of Lead-Free Solder Interconnect Technology ISBN: 1461492653 ISBN-13(EAN): 9781461492658 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
Автор: Ayan Mandal; Sunil P. Khatri; Rabi Mahapatra Название: Source-Synchronous Networks-On-Chip ISBN: 1461494044 ISBN-13(EAN): 9781461494041 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. It provides circuit-level details of the NoC and includes architectural simulations of the NoC.
Автор: Mustafa Celik; Larry Pileggi; Altan Odabasioglu Название: IC Interconnect Analysis ISBN: 1475776748 ISBN-13(EAN): 9781475776744 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
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