Interconnect Technologies for Integrated Circuits and Flexible Electronics, Yash Agrawal
Автор: Chong Leong, Gan, Chen-Yu, Huang Название: Interconnect Reliability in Advanced Memory Device Packaging ISBN: 3031267079 ISBN-13(EAN): 9783031267079 Издательство: Springer Рейтинг: Цена: 27950.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Автор: Mohamed Elgamel; Magdy A. Bayoumi Название: Interconnect Noise Optimization in Nanometer Technologies ISBN: 1441938443 ISBN-13(EAN): 9781441938442 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Interconnect has become the dominating factor in determining system performance in nanometer technologies. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits.
In this monograph, the effects of wire size, spacing between wires, wire length, coupling length, load capacitance, rise time of the inputs, place of overlap (near driver or receiver side), frequency, shields, direction of the signals, and wire width for both the aggressors and the victim wires on system performance and reliability is thoroughly investigated. Also, parameters like driver strength has been considered as several recent studies considered the simultaneous device and interconnect sizing. Crosstalk noise, as well as the impact of coupling on aggressor delay is analyzed. The pulse width of the crosstalk noise, which is of similar importance for circuit performance as the peak amplitude, is also analyzed. We have considered more parameters that can affect the signal integrity and presented practical intensive simulation results.
This book brings together a wealth of information previously scattered throughout the literature, presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. The practical aspects of the algorithms and models are explained with sufficient detail.
It deeply investigates the most two effective parameters in layout optimization, spacing and shield insertion, that can affect both capacitive and inductive noise. Noise models needed for layouts with multi-layer multi-crosscoupling segments are investigated. Different post-layout optimization techniques are explained with complexity analysis and benchmarks tests are provided.
Описание: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Автор: Coppola, Marcello Название: Design of Cost-Efficient Interconnect Processing Units ISBN: 1420044710 ISBN-13(EAN): 9781420044713 Издательство: Taylor&Francis Рейтинг: Цена: 18374.00 р. Наличие на складе: Нет в наличии.
Описание: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong Название: Fundamentals of Lead-Free Solder Interconnect Technology ISBN: 1461492653 ISBN-13(EAN): 9781461492658 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
Автор: Ian O`Connor; Gabriela Nicolescu Название: Integrated Optical Interconnect Architectures for Embedded Systems ISBN: 1489992049 ISBN-13(EAN): 9781489992048 Издательство: Springer Рейтинг: Цена: 16977.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book highlights current research in optical interconnect technologies and architectures. Particular emphasis is given to the ways photonic components are assembled into architectures to address the needs of data-intensive on-chip communication.
Автор: Sandeep Saini Название: Low Power Interconnect Design ISBN: 1461413222 ISBN-13(EAN): 9781461413226 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.
Автор: Mustafa Celik; Larry Pileggi; Altan Odabasioglu Название: IC Interconnect Analysis ISBN: 1475776748 ISBN-13(EAN): 9781475776744 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.
Автор: Ayan Mandal; Sunil P. Khatri; Rabi Mahapatra Название: Source-Synchronous Networks-On-Chip ISBN: 1461494044 ISBN-13(EAN): 9781461494041 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. It provides circuit-level details of the NoC and includes architectural simulations of the NoC.
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