Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design, Sandip Bhattacharya
Автор: Chong Leong, Gan, Chen-Yu, Huang Название: Interconnect Reliability in Advanced Memory Device Packaging ISBN: 3031267079 ISBN-13(EAN): 9783031267079 Издательство: Springer Рейтинг: Цена: 27950.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Описание: This book introduces the space community to the novel SpaceFibre protocol, developed under the guidance of the European Space Agency (ESA) as the forthcoming, high speed (Gbps) communication protocol for satellite on-board communication.
Автор: Nannipieri Название: Next-Generation High-Speed Satellite Interconnect ISBN: 303077046X ISBN-13(EAN): 9783030770464 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book introduces the space community to the novel SpaceFibre protocol, developed under the guidance of the European Space Agency (ESA) as the forthcoming, high speed (Gbps) communication protocol for satellite on-board communication.
Автор: Ian O`Connor; Gabriela Nicolescu Название: Integrated Optical Interconnect Architectures for Embedded Systems ISBN: 1489992049 ISBN-13(EAN): 9781489992048 Издательство: Springer Рейтинг: Цена: 16977.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book highlights current research in optical interconnect technologies and architectures. Particular emphasis is given to the ways photonic components are assembled into architectures to address the needs of data-intensive on-chip communication.
Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.
Автор: Ayan Mandal; Sunil P. Khatri; Rabi Mahapatra Название: Source-Synchronous Networks-On-Chip ISBN: 1493948172 ISBN-13(EAN): 9781493948178 Издательство: Springer Рейтинг: Цена: 14365.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. It provides circuit-level details of the NoC and includes architectural simulations of the NoC.
Автор: Yoshimura, Tetsuzo Название: Self-Organized 3D Integrated Optical Interconnects ISBN: 9814877042 ISBN-13(EAN): 9789814877046 Издательство: Taylor&Francis Рейтинг: Цена: 17762.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Currently, light waves are ready to come into boxes of computers in high-performance computing systems.
Автор: Mustafa Celik; Larry Pileggi; Altan Odabasioglu Название: IC Interconnect Analysis ISBN: 1475776748 ISBN-13(EAN): 9781475776744 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong Название: Fundamentals of Lead-Free Solder Interconnect Technology ISBN: 1461492653 ISBN-13(EAN): 9781461492658 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
Автор: Tapan Gupta Название: Copper Interconnect Technology ISBN: 1489985115 ISBN-13(EAN): 9781489985118 Издательство: Springer Рейтинг: Цена: 22201.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Описание: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
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