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Monolithic Integration in E-Mode GaN Technology, Kaufmann


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Цена: 8384.00р.
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При оформлении заказа до: 2025-07-28
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Автор: Kaufmann
Название:  Monolithic Integration in E-Mode GaN Technology
ISBN: 9783031156274
Издательство: Springer
Классификация:


ISBN-10: 3031156277
Обложка/Формат: Soft cover
Страницы: 174
Вес: 0.00 кг.
Дата издания: 11.11.2023
Серия: Synthesis lectures on engineering, science, and technology
Язык: English
Издание: 1st ed. 2022
Иллюстрации: 81 illustrations, color; 22 illustrations, black and white; xiii, 174 p. 103 illus., 81 illus. in color.
Размер: 240 x 168
Основная тема: Engineering
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: This book is a comprehensive, all-in-one source on design of monolithic GaN power ICs. It is written in handbook style with systematic guidelines and includes implementation examples. It covers the full range from technology fundamentals to implementation details including design techniques specific for GaN technology. It provides a detailed loss analysis based on comparative measurements between silicon and GaN based converters to provide an understanding of the relations between design choices and results which can be transferred to other power converter systems.
Дополнительное описание: Introduction.- Fundamentals on GaN Technology for Integration of Power Electronics.- Circuit Integration in E-Mode GaN.- System Integration in Monolithic GaN.- Performance Comparison of Monolithic GaN and Silicon Converters.- Conclusion and Outlook.



Interconnect Reliability in Advanced Memory Device Packaging

Автор: Chong Leong, Gan, Chen-Yu, Huang
Название: Interconnect Reliability in Advanced Memory Device Packaging
ISBN: 3031267079 ISBN-13(EAN): 9783031267079
Издательство: Springer
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Цена: 27950.00 р.
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Описание: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Gan Transistor Modeling For Rf And Power Electronics

Автор: Chauhan,Yogesh Singh
Название: Gan Transistor Modeling For Rf And Power Electronics
ISBN: 0323998712 ISBN-13(EAN): 9780323998710
Издательство: Elsevier Science
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Цена: 27791.00 р.
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GaN and Related Materials

Автор: Pearton, Stephen J.
Название: GaN and Related Materials
ISBN: 9056995170 ISBN-13(EAN): 9789056995171
Издательство: Taylor&Francis
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Цена: 15004.00 р.
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Advanced SPICE Model for GaN HEMTs (ASM-HEMT)

Автор: Khandelwal
Название: Advanced SPICE Model for GaN HEMTs (ASM-HEMT)
ISBN: 3030777324 ISBN-13(EAN): 9783030777326
Издательство: Springer
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Цена: 11878.00 р.
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Описание: This book discusses in detail the Advanced SPICE Model for GaN HEMTs (ASM-HEMT), a new industry standard model for GaN-based power and RF circuit design. The author describes this new, standard model in detail, covering the different components of the ASM GaN model from fundamental derivations to the implementation in circuit simulation tools. The book also includes a detailed description of parameter extraction steps and model quality tests, which are critically important for effective use of this standard model in circuit simulation and product design. Coverage includes both radio-frequency (RF), and power electronics applications of this model. Practical issues related to measurement data and parameter extraction flow are also discussed, enabling readers easily to adopt this new model for design flow and simulation tools. * Describes in detail a new industry standard for GaN-based power and RF circuit design; * Includes discussion of practical problems and their solutions in GaN device modeling; * Covers both radio-frequency (RF) and power electronics application of GaN technology; * Describes modeling of both GaN RF and power devices.

Highly Integrated Gate Drivers for Si and GaN Power Transistors

Автор: Seidel Achim, Wicht Bernhard
Название: Highly Integrated Gate Drivers for Si and GaN Power Transistors
ISBN: 3030689425 ISBN-13(EAN): 9783030689421
Издательство: Springer
Рейтинг:
Цена: 11878.00 р.
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Описание: The authors cover the full range from fundamentals to implementation details including topics like power stages, various kinds of gate drivers (resonant, non-resonant, current-source, voltage-source), gate drive schemes, driver supply, gate loop, gate driver power efficiency and comparison silicon versus GaN transistors.

Advanced Spice Model for Gan Hemts (Asm-Hemt): A New Industry-Standard Compact Model for Gan-Based Power and RF Circuit Design

Автор: Khandelwal Sourabh
Название: Advanced Spice Model for Gan Hemts (Asm-Hemt): A New Industry-Standard Compact Model for Gan-Based Power and RF Circuit Design
ISBN: 3030777294 ISBN-13(EAN): 9783030777296
Издательство: Springer
Рейтинг:
Цена: 11878.00 р.
Наличие на складе: Поставка под заказ.

Описание: This book discusses in detail the Advanced SPICE Model for GaN HEMTs (ASM-HEMT), a new industry standard model for GaN-based power and RF circuit design. The author describes this new, standard model in detail, covering the different components of the ASM GaN model from fundamental derivations to the implementation in circuit simulation tools. The book also includes a detailed description of parameter extraction steps and model quality tests, which are critically important for effective use of this standard model in circuit simulation and product design. Coverage includes both radio-frequency (RF), and power electronics applications of this model. Practical issues related to measurement data and parameter extraction flow are also discussed, enabling readers easily to adopt this new model for design flow and simulation tools. * Describes in detail a new industry standard for GaN-based power and RF circuit design; * Includes discussion of practical problems and their solutions in GaN device modeling; * Covers both radio-frequency (RF) and power electronics application of GaN technology; * Describes modeling of both GaN RF and power devices.

Gauge Invariance Approach to Acoustic Fields

Автор: Gan Woon Siong
Название: Gauge Invariance Approach to Acoustic Fields
ISBN: 9811387532 ISBN-13(EAN): 9789811387531
Издательство: Springer
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Цена: 13974.00 р.
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Описание: This book highlights the symmetry properties of acoustic fields and describes the gauge invariance approach, which can be used to reveal those properties. This is followed by descriptions of global gauge invariance (isotropy), and of local gauge invariance (anisotropy).

High-Frequency Gan Electronic Devices

Автор: Fay Patrick, Jena Debdeep, Maki Paul
Название: High-Frequency Gan Electronic Devices
ISBN: 3030202100 ISBN-13(EAN): 9783030202101
Издательство: Springer
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Цена: 16769.00 р.
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Описание:

Chapter 1. Introduction.- Chapter 2.High Power High Frequency Transistors: A Materials Perspective.- Chapter 3. Isotope Engineering of GaN for Boosting Transistor Speeds.- Chapter 4. Linearity Aspects of High Power Amplification in GaN Transistors.- Chapter 5. III-Nitride Tunneling Hot Electron Transfer Amplifier (THETA).- Chapter 6.Plasma-Wave Propagation in GaN and Its Applications.- Chapter 7.Numerical Simulation of Distributed Electromagnetic and Plasma-wave Effect Devices.- Chapter 8.Resonant Tunneling Transport in Polar III-Nitride Heterostructures.- Chapter 9.Fabrication and Characterization of GaN/AlN Resonant Tunneling Diodes.- Chapter 10.Non-Contact Metrology for mm-wave and THz Electronics.

Highly Integrated Gate Drivers for Si and Gan Power Transistors

Автор: Seidel Achim, Wicht Bernhard
Название: Highly Integrated Gate Drivers for Si and Gan Power Transistors
ISBN: 3030689395 ISBN-13(EAN): 9783030689391
Издательство: Springer
Цена: 11878.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The authors cover the full range from fundamentals to implementation details including topics like power stages, various kinds of gate drivers (resonant, non-resonant, current-source, voltage-source), gate drive schemes, driver supply, gate loop, gate driver power efficiency and comparison silicon versus GaN transistors.

Gallium Nitride (GaN)

Название: Gallium Nitride (GaN)
ISBN: 1482220032 ISBN-13(EAN): 9781482220032
Издательство: Taylor&Francis
Рейтинг:
Цена: 33686.00 р.
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Описание:

Addresses a Growing Need for High-Power and High-Frequency Transistors

Gallium Nitride (GaN): Physics, Devices, and Technology offers a balanced perspective on the state of the art in gallium nitride technology. A semiconductor commonly used in bright light-emitting diodes, GaN can serve as a great alternative to existing devices used in microelectronics. It has a wide band gap and high electron mobility that gives it special properties for applications in optoelectronic, high-power, and high-frequency devices, and because of its high off-state breakdown strength combined with excellent on-state channel conductivity, GaN is an ideal candidate for switching power transistors.

Explores Recent Progress in High-Frequency GaN Technology

Written by a panel of academic and industry experts from around the globe, this book reviews the advantages of GaN-based material systems suitable for high-frequency, high-power applications. It provides an overview of the semiconductor environment, outlines the fundamental device physics of GaN, and describes GaN materials and device structures that are needed for the next stage of microelectronics and optoelectronics. The book details the development of radio frequency (RF) semiconductor devices and circuits, considers the current challenges that the industry now faces, and examines future trends.

In addition, the authors:

  • Propose a design in which multiple LED stacks can be connected in a series using interband tunnel junction (TJ) interconnects
  • Examine GaN technology while in its early stages of high-volume deployment in commercial and military products
  • Consider the potential use of both sunlight and hydrogen as promising and prominent energy sources for this technology
  • Introduce two unique methods, PEC oxidation and vapor cooling condensation methods, for the deposition of high-quality oxide layers

A single-source reference for students and professionals, Gallium Nitride (GaN): Physics, Devices, and Technology provides an overall assessment of the semiconductor environment, discusses the potential use of GaN-based technology for RF semiconductor devices, and highlights the current and emerging applications of GaN.

Handbook Of Gan Semiconductor Mater

Название: Handbook Of Gan Semiconductor Mater
ISBN: 1498747132 ISBN-13(EAN): 9781498747134
Издательство: Taylor&Francis
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Цена: 41342.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This book addresses material growth, device fabrication, device application, and commercialization of energy-efficient white light-emitting diodes (LEDs), laser diodes, and power electronics devices. It covers the basics of semiconductor materials, physics, growth and characterization techniques.

Control Components Using Si, GaAs, and GaN Technologies

Автор: Inder J. Bahl
Название: Control Components Using Si, GaAs, and GaN Technologies
ISBN: 160807711X ISBN-13(EAN): 9781608077113
Издательство: Artech House
Рейтинг:
Цена: 17371.00 р.
Наличие на складе: Нет в наличии.

Описание: The unique features of this book include in-depth and comprehensive study of control circuits, extensive design equations and figures, treatment of practical aspect of circuits, and description of fabrication technologies.


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